This is a speaker cable using oxygen-free conductor manufactured by the dip-forming method developed by GE in the U.S.A., and the latest 3rd generation magnesium shield is used for the shielding layer. The use of oxygen-free copper (dielectric constant 101% to 102%) manufactured in Japan’s only remaining dip-forming furnace achieves a vivid analog sound that cannot be experienced with the latest conductors. This is a high cost-performance model that inherits most of the construction and materials of the higher-end model SP1.